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Cyg Tefa Co., Ltd.

Anti-Static Foam Roll, ESD Foam Material, Flame Retardant Polyethylene Foam manufacturer / supplier in China, offering ESD Conductive Polyethlene Foam Anti-Static PE Foam for LCD Packaging, Polyethylene Foam Sheet Chinese Supplier, 3mm Insulation Foam Thin Thermal Insulation PE Foam and so on.

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ESD Conductive Polyethlene Foam Anti-Static PE Foam for LCD Packaging

FOB Price: Get Latest Price
Min. Order: 1,000 Pieces
Production Capacity: 500000 PCS/Year
Transport Package: Commonly PE Bags or as Your Request
Payment Terms: L/C, T/T, D/P, Western Union, Paypal, Money Gram

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Basic Info
  • Model NO.: CYG foam
  • Usage: Electronic Product Packaging
  • Expansion Rate: 10-25 Times
  • Width: Within 2500 mm. OEM Service Is Welcomed.
  • Hardness: 10-80 Shores
  • Trademark: CYG
  • Origin: Shenzhen
  • Material: Polyethylene/PE
  • Color: All Kinds
  • Thickness: 1-50 mm
  • Size: Customized
  • Delivery Time: 15-20 Working Days
  • Specification: ROHS, SGS, UL, ISO9001, and REACH
  • HS Code: 3921199000
Product Description

1. Product description


Anti-static foam is produced by compounding PE with some special padding and foaming material,
Then cross linkinked by foaming. The conductivity IXPE foam is a hi-tech ESD product which has
Very good anti-static property, it is an ideal packing material for optoelectronic devices and
Microelectronics devices, integrated circuit, printed circuit board, communications, military products etc.

The Conductive IXPE foam is closed cell soft foam which takes polyethylene (PE) as a raw
Material, through adding anti-static materials and then crosslinked by irradiation and foaming.
After foaming, the conductive filler in the interior of sheet formed a conductive path/network,
So as to achieve the purpose of static leakage.
The dimension can be designed by customers' requirements, for optoelectronic devices,
Microelectronic devices packaging, and its anti-static property will not be changed for
Postprocessing.

Conductive PE foam tray
Conductive polyethylene foam tray can be divided into several kind as below
According to its usage
A. Conductive Foam packing tray is used for packing or conveying of high-end components, integrated circuit and printed circuit board.
B. Conductive Foam turnover tray is used for IC products for packing or shipment.
C. Conductive Foam blister tray with fine appearance, is used for packing and conveying
Of communications or military products in the workshop or shipment.

Features:
1. Static dissipative;
2. Chemical corrosion resistance;
3. Excellent permanent ESD effect, excellent conductive effect:
Resistivity value 103-109 Ω /sq;
4. Superior buffering and cushioning performance;
5. Moistureproof, heat insulation;
6. Friendly environmentally, non-toxic, no odor;
7. Good performance, can be processed to various shapes by customer's requirements.
7. Intrinsic conductive path/network, excellent anti-static performance;
8. Without the use of environmental humidity can make electrostatic quickly leaked, anti-static property isn't affected by environmental humidity;
9. Long term anti-static.


2. Advantages
1. Medium and high quality are often customized to meet different market.
2. High Cost effective
3. High fire resistance
4. Good after-sale service
5. Strong capacity: One day one container
6. OEM service, 12 years manufacture experience, sample in stock can be offered in one working day


3. Our services
Factory direct selling with low price, sooner leadtime, customized service.

4. Comany info
CYG TeFa Co., Ltd has 14years experience of producting XPE & IXPE foam. We're the biggest and the most professional irradiation crosslinked polyethylene conductive foam manufacturer in China and has the most complete crosslinked polyethylene foam products. Our main products are Crosslinked PE foam material, IXPE foam, XPE foam, Conductive IXPE foam; ESD foam tray, ESD packing material; Beach mat, camping mat, sleeping mat, yoga mat; Etc.

About ours
14years history for producing Foam.
3 production bases in China
10 production lines.
Customers: Huawei, ZTE, Samsung, Foxconn, Flextronics and other well-know electronic and communications enterprises.


5. Application Field:
An ideal packing material for optoelectronic devices, integrated circuit, printed circuit board, communications, military products etc.

Item
 

Unit
 

Conductive type
 

A nti-static type
 

Surface resistivity  
 

?/square
 

10 3 _ 10 6
 

10 6 _ 10 9 

Volume   resistivity
 

? .cm
 

10 3 _ 10 6
 

10 6 _ 10 9  
 

Tensile strength
 

MPa
 

> 0.5
 

> 0.5
 

Elongation
 

%
 

> 150
 

> 150
 

Tearing Stength
 

N/mm
 

> 1.2
 

> 1.2
 

C olor 
 

 
 

B lack
 

B lack
 

D ensity 
 

Kg/m 3
 

30-45
 

30-45
 

Electrostatic Attenuating time

 
 

S
 

<0.5
 

<.5
 

Abrasive Potential
 

V
 

<100
 

<100
 

ESD Conductive Polyethlene Foam Anti-Static PE Foam for LCD PackagingESD Conductive Polyethlene Foam Anti-Static PE Foam for LCD PackagingESD Conductive Polyethlene Foam Anti-Static PE Foam for LCD PackagingESD Conductive Polyethlene Foam Anti-Static PE Foam for LCD PackagingESD Conductive Polyethlene Foam Anti-Static PE Foam for LCD PackagingESD Conductive Polyethlene Foam Anti-Static PE Foam for LCD Packaging
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